Dupont Electronic Technology Co.
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TG is a kind of organosilicon mixture filled with metal oxide, which has excellent thermal conductivity. It is a mixture composed of high-purity filler and organosilicon, which is white, smooth, uniform, almost free of oil separation or high-temperature volatilization, and really has significant thermal conductivity. It is mainly applied to the assembly surface of semiconductor devices and radiators and the heat dissipation of special-shaped devices, eliminating the air on the contact surface, increasing the heat flow channel and improving the heat conduction. This means that electronic devices can work at lower temperatures, thereby improving their efficiency and service life.
Item & Unit | Specification | Test method | |||||
TG-10 | TG-15 | TG-20 | TG-30 | TG-40 | TG-50 | ||
Appearance | White | White | Grey | Grey | Grey | Grey | Visual inspection |
Proportion (25℃) g/cm³ | 2.1±0.1 | 2.2±0.1 | 2.40±0.1 | 2.6±0.1 | 2.8±0.1 | 3.2±0.1 | ASTM D792 |
Thermal conductivity W/m.k | ≥1.0 | ≥1.5 | ≥2.0 | ≥3.0 | ≥4.0 | ≥5.0 | ASTM D5470 |
Cone Penetration(25℃) | 300±25 | 295±25 | 290±25 | 240±25 | 230±25 | 230±25 | GB/T269-91 |
Volatile(200℃24h)* Wt% | ≤0.7 | ≤0.8 | ≤1.0 | ≤1.0 | ≤1.2 | ≤1.2 | HG/T2502-93 |
Thermal resistance in²k/w(0.1mm@270KPa) | 0.18 | 0.15 | 0.12 | 0.09 | 0.07 | 0.04 | ASTM D5470 |
Work temperature ℃ | -50~200 | -50~200 | -50~200 | -50~200 | -50~200 | -50~200 | GB/T2423.2 |
Typical applications
l Chip processor
l BGA, flash memory chip
l Power supply components, LED
l 
Special shaped heating device
